| Predicate |
Object |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L81-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
1988-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1998-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
1998-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2701362-B2 |
| titleOfInvention |
Resin composition for sealing electronic parts |
| priorityDate |
1988-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |