Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3254 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-38 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
filingDate |
1991-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
1997-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
1997-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2570002-B2 |
titleOfInvention |
Flip chip sealing material and semiconductor device |
priorityDate |
1991-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |