| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M10-653
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M10-625 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D183-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-08 |
| filingDate |
2020-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2023-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2023501266-A |
| titleOfInvention |
Thermally conductive curable composition |
| abstract |
This disclosure is a) a base component containing a cationic self-curing silicone-based oligomer compound; b) a curing system for cationic self-curing silicone-based oligomeric compounds; c) a thermally conductive filler. According to another aspect, the present disclosure relates to a method of making a curable composition. In yet another aspect, the present disclosure relates to the use of thermally conductive curable compositions for industrial applications, particularly thermal management applications in the automotive industry. |
| priorityDate |
2019-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |