http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022162611-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate | 2021-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdd76eb4db33d3fcaf75e3eb63109a32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe19e9ffed55aa1d9cf155a490cc109b |
| publicationDate | 2022-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022162611-A |
| titleOfInvention | Negative photosensitive resin composition, resin composition film, cured film, and semiconductor device |
| abstract | An object of the present invention is to provide a resin composition, a resin composition film, a cured film, and a semiconductor device using these, which have excellent pattern processability and whose cured film exhibits low thermal expansion. The component (A) is a polymer selected from the group consisting of polyimides, polyamides, and polyamideimides, the component (B) is an alkoxymethyl compound and/or methylol compound, the component (C) is a photoacid generator, And (D) a negative photosensitive resin composition containing a sensitizer as a component, wherein the component (A) has a polyimide containing an alicyclic structure and / or a polyamide repeating unit containing an alicyclic structure, negative type photosensitive resin composition. [Selection figure] None |
| priorityDate | 2021-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 326.