http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022151305-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73e224665ceb7b15f8e66dfd0ee245c6 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-20 |
| filingDate | 2021-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2ead0a80657fe2a9bdf802c9b0f2cf8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_203096d191df56bb20c8277ec105ae7d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fd4c1d0e97feda0c1e7743467db87de http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32b953fb8f5e5291409762df7ac1c450 |
| publicationDate | 2022-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022151305-A |
| titleOfInvention | Encapsulating resin composition, method for producing encapsulating resin composition, and semiconductor device |
| abstract | Kind Code: A1 A sealing resin composition is provided that can be used to produce a sealing material for sealing a semiconductor element and that can easily achieve a low elastic modulus and a low coefficient of linear expansion of the sealing material. A sealing resin composition contains a resin component (A) and an inorganic filler (B). The resin component (A) comprises a reactive compound (p), a reactive compound (q) having a weight average molecular weight of 1000 or less having thermosetting reactivity with the reactive compound (p), and a thermoplastic polymer (r). contains. A cured product obtained by thermosetting the resin component (A) is a reaction of a matrix containing a thermoplastic polymer (r), a reactive compound (p) dispersed in the matrix, and a reactive compound (q). and a dispersed phase containing the product. [Selection drawing] Fig. 1 |
| priorityDate | 2021-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 66.