http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022151170-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ddb9f3656270bc5410be3679322fead |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C35-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J31-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B32-00 |
| filingDate | 2021-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea83b98e57f0f33e7bb34d4da499b0a5 |
| publicationDate | 2022-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022151170-A |
| titleOfInvention | Thermosetting resin composition and method for producing cured molding using the same |
| abstract | Kind Code: A1 A thermosetting resin composition which can be cured without using a mold after being put into a mold and melt-molded is provided. A thermosetting resin composition according to one embodiment of the present invention comprises (A) a thermosetting resin, (B) 1 to 15% by weight of a microwave sensitive agent, and (C) 0.1 (A) the thermosetting resin is solid at room temperature, (B) the microwave sensitive agent has an average particle size of 1 nm to 100 μm, and (C) the cross-linked Agents are polyfunctional organic compounds. [Selection figure] None |
| priorityDate | 2021-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 137.