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filingDate 2021-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79b1ea95b66eba6134e1a40be239e27d
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publicationDate 2022-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2022150644-A
titleOfInvention Resin composition and molded article
abstract Kind Code: A1 A resin composition for surface treatment, which can give a molded article having high plating adhesion and excellent dielectric properties and high mechanical properties, and a molded article using the same are provided. (A) a liquid crystalline resin; (B) a compound that is at least one selected from the group consisting of oxides, sulfates and phosphates of group II elements of the periodic table; and (C) fibers A resin composition containing a filler, (A) is a wholly aromatic polyester containing predetermined amounts of predetermined structural units (I) to (IV) as essential constituents, The content of (B) is 12.5 to 32.5% by mass with respect to the entire resin composition, and the content of (C) is 2.5% by mass with respect to the entire resin composition. 5 to 7.5% by mass, and the total amount of (B) and (C) is 20 to 40% by mass with respect to the entire resin composition, The resin composition has a dielectric loss tangent of 0.003 or less at a measurement frequency of 5 GHz. [Selection figure] None
priorityDate 2021-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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