http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022148182-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5198a2a21392d6cbc0bb4898b3fb3d29 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M4-1395 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M4-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M4-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M4-38 |
| filingDate | 2021-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0398b9cb1a0883fd520cbcf93d153897 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2590aaefb45e7369f3d3a9f001bc32f4 |
| publicationDate | 2022-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022148182-A |
| titleOfInvention | Liquid composition for forming electrode active material layer |
| abstract | Kind Code: A1 A liquid composition for forming an electrode active material layer is provided, which is capable of enhancing the adhesion of an electrode active material layer containing a Cu-containing metal active material to a current collector. A liquid composition for forming an electrode active material layer of the present disclosure contains metal active material particles containing Cu and absorbing and/or releasing metal ions in an amount of more than 5.0% by mass to 5.0% by mass. Aggregates containing 99.0% by mass, a binder, and a solvent, and containing a plurality of the metal active material particles have a particle diameter of 60 μm or less. [Selection drawing] Fig. 2 |
| priorityDate | 2021-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.