http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022142043-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H02N13-00 |
| filingDate | 2021-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1df4a24444d2fea99619b0936a952289 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bbeb98e013f2efbe547d32911baac100 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_741de79b22a8f9ec086ec481baf0fb69 |
| publicationDate | 2022-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022142043-A |
| titleOfInvention | Laminates, wafer holders, semiconductor manufacturing equipment |
| abstract | An object of the present invention is to provide a laminate, a wafer holder, and a semiconductor manufacturing apparatus having heat resistance and temperature cycle resistance. SOLUTION: A laminate having a member A and a member B having coefficients of linear expansion different by 1 or more and further having a cured product of an adhesive layer C1 between the member A and the member B, The adhesive layer C1 is a laminated sheet having an adhesive sheet D1 and an adhesive sheet E1, The adhesive sheet D1 contains polyimide resin and epoxy resin, A laminate in which the adhesive sheet E1 contains an acrylic resin and an epoxy resin, and has a Tg of 100° C. or less after curing. [Selection figure] None |
| priorityDate | 2021-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 112.