http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022127982-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ba22a49a8c7e60b197ba0d673731015d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2021-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1dfde7c2d63403aceeda914875eba5c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8ad10d6db9292c63237accd18c8ca57 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecf82a7b687fa0fd9569fd8dead790fb |
| publicationDate | 2022-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022127982-A |
| titleOfInvention | Plating solution, plating method and metal material |
| abstract | A plating technique capable of forming a roughened surface with excellent adhesion to a mold resin by a simple process is provided. 200 g/L of copper sulfate pentahydrate, 25 g/L of sulfuric acid, 400 ppm of hydrochloric acid, 13.75% by weight of polyethylene glycol as an inhibitor, and 1,2-ethanedisulfonic acid dihydrate as an accelerator. A plating method for plating a lead frame 10 using a plating solution containing 7.5% by weight of a substance, wherein a first current is applied for a first period using the lead frame 10 as an electrode, and a coating is formed on the surface of the metal material 10 a first film destruction treatment that performs a destruction treatment; after the first film destruction treatment, a second current is applied for a second period using the lead frame 10 as an electrode to form a plating layer; a first plating treatment that forms a plating layer; A plating treatment method for plating a lead frame 10 by repeating a first film forming treatment for forming a film layer with zero potential for three periods for a predetermined number of times. [Selection drawing] Fig. 2 |
| priorityDate | 2021-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.