http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022114048-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2021-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7e76745ca90739d72371fdd1950a9a5 |
| publicationDate | 2022-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022114048-A |
| titleOfInvention | power module |
| abstract | A technique for improving heat dissipation performance by dissipating heat from both sides of a power semiconductor element in a power module is provided. A power module (100) includes a power semiconductor element (1), a first heat dissipation structure (10) provided on the lower surface (1a) side of the power semiconductor element (1), a second heat dissipation structure (20) provided on the upper surface (1b) side, and the power semiconductor element (1). and the first heat dissipation structure 10 by sintering paste, the spacer 30 between the power semiconductor element 1 and the second heat dissipation structure 20, and the second heat dissipation structure 20 and the spacer 30 are sintered. A region between a second bonding layer 22 that bonds with a ring paste, a third bonding layer 32 that connects the power semiconductor element 1 and the spacer 30 with a sintering paste, and the first heat dissipation structure 10 and the second heat dissipation structure 20 has a sealing material layer 50 in which the power semiconductor element 1, the spacer 30 and the region where the first to third bonding layers 12, 22, 32 are not provided are sealed with a mold sealing material. [Selection drawing] Fig. 2 |
| priorityDate | 2021-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 155.