http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022113418-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73e224665ceb7b15f8e66dfd0ee245c6 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 |
| filingDate | 2021-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc2e37ce69f21469ee98ce7dba7076b9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98c3fad6dcf943ba6dd30a705f8a729c |
| publicationDate | 2022-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022113418-A |
| titleOfInvention | Resin flux solder paste and mounting structure |
| abstract | Kind Code: A1 The present invention provides a resin flux solder paste that is excellent in applicability to high-melting-point solder and has both excellent connection stability (solder meltability) and excellent shear adhesive strength, and an electronic component is mounted using the same. provide an implementation struct. A resin flux solder paste is a solder paste containing solder powder and flux. The flux contains at least an epoxy resin, a curing agent, a curing accelerator, an activator, and a curing reaction modifier. The curing agent includes a phenolic novolak resin. The curing accelerator includes a boron-containing compound. The curing reaction modifier includes a phosphorus-containing compound. The ratio of the curing reaction modifier to the curing accelerator (curing reaction modifier/curing accelerator (w/w)) is 5/1 to 1/1. [Selection drawing] Fig. 1 |
| priorityDate | 2021-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 46.