http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022104464-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00
filingDate 2020-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f11483298f5f6a4b4fec9e53fa1c917
publicationDate 2022-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2022104464-A
titleOfInvention Manufacturing method of release film and molded product
abstract PROBLEM TO BE SOLVED: To use a mold release film capable of contacting and forming a functional layer in a resin molded portion without an adhesive layer, and such a mold release film to form a resin molded portion and the resin molded portion. To provide a method for manufacturing a molded product that forms a functional layer laminated in contact with each other. SOLUTION: The release film 200 of the present invention is used for forming a resin molded portion composed of a resin material as a main material and a functional layer covering the surface of the resin molded portion, and has releasability. A support layer 210 having a mold release surface and a heat radiation layer 30 as a functional layer provided on the mold release surface of the support layer 210 are provided, and the resin molded portion is molded by a heating press. The heat dissipation layer 30 as a functional layer is configured to be transferred so as to cover the surface of the resin molded portion. [Selection diagram] FIG. 6
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7343030-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7343029-B1
priorityDate 2020-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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