http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022098698-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2020-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22df5f2bf2a9d81deee19265e1f4236b |
| publicationDate | 2022-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022098698-A |
| titleOfInvention | Resin composition and power module |
| abstract | PROBLEM TO BE SOLVED: To provide a resin-sealed power module capable of ensuring high reliability even in a high temperature range, and a resin composition for use as a resin encapsulating material for such a power module. SOLUTION: A metal circuit board 3, a power semiconductor element 1 provided on one surface of the metal circuit board, a bonding layer 2 made of a syntaring paste for joining the power semiconductor element and the metal circuit board, and a metal circuit. In the power module 10 provided with the heat dissipation sheet 4 laminated on the surface of the substrate opposite to the surface on which the power semiconductor element is provided, the epoxy resin and the inorganic filler used for sealing these are included. In the resin composition, the glass transition temperature of the resin composition is 170 ° C. or higher and 300 ° C. or lower, and the average linear expansion coefficient α1 at the glass transition temperature or higher of the cured product of the resin composition is 5 ppm / K or higher and 15 ppm / K or lower. The average linear expansion coefficient α2 at the glass transition temperature or lower is 25 ppm / K or more and 65 ppm / K or less. [Selection diagram] Fig. 1 |
| priorityDate | 2020-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 172.