http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022098629-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8205ec6ee1cd95eb60a03826535bad97 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F22-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-02 |
| filingDate | 2020-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64643464c064e73d5eb5c1105c8bb26f |
| publicationDate | 2022-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022098629-A |
| titleOfInvention | Metal surface coating film forming composition containing maleimide polymer |
| abstract | PROBLEM TO BE SOLVED: To provide an oxidation-suppressing film-forming composition for semiconductors for preventing surface oxidation of a rewired metal, which is useful in a rewiring forming step in a semiconductor post-process, and a metal. (Oxidation-suppressing film-forming composition, semiconductor rewiring and adhesion-improving film-forming composition for interlayer insulating film), wiring substrates using them, semiconductor devices, and methods for manufacturing them. SOLUTION: This is a metal surface coating film forming composition containing a polymer containing a unit structure having a maleimide group and an organic solvent. It is preferred that the polymer further comprises a unit structure containing a crosslinkable moiety. [Selection diagram] Fig. 3 |
| priorityDate | 2020-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 94.