http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022087035-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ca4a4e36e37395a0133b2c18f5c533b5 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-285 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-142 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-02 |
| filingDate | 2021-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c54e00a0a397181696dbcae5fd0a6cb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c18e6bf1d7abdd6fa4d9838bca089f2 |
| publicationDate | 2022-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022087035-A |
| titleOfInvention | A light or thermosetting resin composition and a cured resin thereof, a semiconductor package and a printed circuit board using the cured resin. |
| abstract | PROBLEM TO BE SOLVED: To permanently suppress the occurrence of cracks and cracks while ensuring the alkali developer resistance, moisture resistance reliability and heat resistance of a pattern portion, and also have excellent adhesion reliability with a substrate and chemical resistance. Provided is a light or thermosetting resin composition that gives a suitable resin cured product to an insulating film. An alkylene of at least one acrylate selected from (meth) acrylates or oligomers thereof with respect to 100 parts by mass of an unsaturated group-containing alkali-soluble resin (A) represented by the formula (1). 10 to 100 parts by mass of the oxide modified product (B), 0.1 to 50 parts by mass of the compound (C) containing an epoxy group, and 0.01 to 0.01 to a photopolymerization initiator and / or a photosensitizer (D). Contains 10 parts by mass. [Selection diagram] None |
| priorityDate | 2020-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 263.