http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022083993-A

Outgoing Links

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filingDate 2021-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48f393a2b58c7a38eb63a60c210eebda
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publicationDate 2022-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2022083993-A
titleOfInvention Package drying equipment in semiconductor strip cutting and sorting equipment
abstract PROBLEM TO BE SOLVED: To effectively remove a cleaning liquid remaining in an individualized semiconductor package and prevent water from scattering to other devices, and a semiconductor strip including the package drying device. Provides cutting and sorting equipment. A package drying device for drying a package individualized by a semiconductor strip cutting and sorting facility according to an embodiment of the present invention includes a base on which the package is mounted and moves along a transfer guide, and a base. A shield unit installed so as to wrap the base in the movement path of the above, an air injection unit installed in the shield unit and injecting air toward a package mounted on the base, and an air injection unit installed in the shield unit. A suction unit for sucking water scattered from the package is included. [Selection diagram] FIG. 5
priorityDate 2020-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 27.