http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022080836-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate | 2021-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c13f0b6a158b8df7e1bd5127539830a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_950e152ec7442043070350e5937f9412 |
| publicationDate | 2022-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022080836-A |
| titleOfInvention | Dicing die bond film |
| abstract | PROBLEM TO BE SOLVED: To provide a dicing die bond film capable of improving the adhesion between a die bond layer and a semiconductor wafer having a metal layer. A dicing die bond film according to the present invention comprises a dicing tape in which an adhesive layer is laminated on a base material layer, and a dicing tape laminated on the adhesive layer of the dicing tape. The layer contains a matrix resin, a thiol group-containing compound, and conductive particles. [Selection diagram] Fig. 1 |
| priorityDate | 2020-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 107.