http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022076436-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73e224665ceb7b15f8e66dfd0ee245c6 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83951 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G65-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2021-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85e4924c7fddd4a04a5abce0550ca1ba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2a4fd546799de15969165510790f9db |
| publicationDate | 2022-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022076436-A |
| titleOfInvention | Resin composition for side fill, semiconductor device, method for removing side fill material, and method for manufacturing semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To have high deep curability even if a part of a gap between a base material and a mounting component in a mounting component of a semiconductor device is interposed by a side fill, the cured product has excellent heat resistance, and the cured product has excellent heat resistance. Provided is a resin composition for a side fill capable of imparting excellent repairability. SOLUTION: A resin composition for side fill is interposed between a base material 2 and a peripheral edge portion of a surface of a mounting component 3 surface-mounted on the base material 2 facing the base material 2. It is used to make the material 4. The resin composition for side fill contains a cationically polymerizable component (A) and a polymerization initiator (B). The polymerization initiator (B) contains a cationic polymerization initiator (B1) containing a thermal cationic polymerization initiator (B11). [Selection diagram] Fig. 1 |
| priorityDate | 2020-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 63.