http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022066011-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dc45703f67bc72a6db582867886fd5d5 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1664 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1637 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1628 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1619 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1632 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-54 |
| filingDate | 2020-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20be471edecbc86548781d33c7086e82 |
| publicationDate | 2022-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022066011-A |
| titleOfInvention | Metal plating film film forming method and film forming equipment |
| abstract | PROBLEM TO BE SOLVED: To provide a film forming method and a film forming apparatus of a metal plating film capable of suppressing damage of a porous film. The method for forming a metal plating film of the present invention is a method for forming a metal plating film on the surface of a metal substrate by a solid phase displacement type electroless plating method, and is at least a method for forming a metal plating film. A housing having a bottom wall and a side wall surrounding the bottom wall and having a storage space inside, a metal base material arranged on the bottom surface inside the housing, and a metal base material arranged on the surface of the metal base material. A preparatory step for preparing a film forming apparatus having the porous film and the electrolytically-free plating solution accommodated in the accommodating space, and the electrolytic-free film contained inside the porous film using the film-forming apparatus. It is characterized by comprising a film forming step of forming a metal plating film on the surface of the metal substrate by precipitating the metal ions derived from the plating solution on the surface of the metal substrate. .. [Selection diagram] Fig. 1 |
| priorityDate | 2020-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 70.