| abstract |
PROBLEM TO BE SOLVED: To provide a flux capable of realizing soldering with less generation of voids, improving the wettability of solder and suppressing missing, and a solder paste using this flux. The present invention is a flux used for a solder paste, which is characterized by containing methyl hydrogenated rosinate, a compound represented by the general formula (p1), and a solvent. In the general formula (p1), R 1 , R 2 , R 3 and R 4 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. [Chemical 1] [Selection diagram] None |