http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022058250-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9e1bf06f55de84b78abc9a057807f7eb |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34 |
| filingDate | 2021-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_464cb5e60591b4364b5851c047f64de3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdb6d87dab37a573439a007fc47ee6ca |
| publicationDate | 2022-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022058250-A |
| titleOfInvention | Polyamide-based laminated film |
| abstract | PROBLEM TO BE SOLVED: To provide a laminated film in which all layers are made of a polyamide resin, which has good heat-sealing properties, and maintains excellent heat-sealing properties even after a heat treatment such as boiling treatment, and heat-sealing. Provided is a laminated film which does not cause wrinkles or deformation in a portion and has excellent pinhole resistance. SOLUTION: This is a laminated film in which a sealant layer is laminated on a base material layer, the base material layer is a film (A) containing polyamide 6, and the sealant layer has a melting point of more than 150 ° C. and 210 ° C. A biaxially oriented film (B) containing the following polyamide-based resin, in which the sealant layers are heat-sealed with a top surface temperature of 200 ° C., a bottom surface temperature of 150 ° C., a sealing pressure of 0.3 MPa, and a sealing time of 3.0 seconds. A polyamide-based laminated film characterized in that the sealing strength of the portion is 1.0 kg / 15 mm or more. [Selection diagram] None |
| priorityDate | 2020-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.