http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022054947-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2020-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0125732a7d350b1ccf8c57ae57b2629 |
| publicationDate | 2022-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022054947-A |
| titleOfInvention | Encapsulating resin composition |
| abstract | PROBLEM TO BE SOLVED: To provide a sealing material having excellent adhesion to a metal. A sealing resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the component (A) is (A1) a naphthylene ether type epoxy resin. The breaking toughness value K Q of the sealing resin composition measured in accordance with the K Q method specified in ASTM D5045-99 is 2.20 MPa · m 1/2 or more and 10 MPa · m 1 . A resin composition for encapsulation that is / 2 or less. [Selection diagram] None |
| priorityDate | 2020-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 107.