http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022054425-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c067d1bbfe85ac23d961d454a35d0e |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F291-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2021-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa503cdb2b37758af9178c694ac76596 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7af791dd14f628a77498641143124308 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb0944cf739eafc0739606d8424dfe78 |
| publicationDate | 2022-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022054425-A |
| titleOfInvention | Photosensitive resin composition, cured product and electronic circuit board |
| abstract | PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having good heat resistance and flexibility and easy to remove with an alkaline developer. SOLUTION: The (A) carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) an epoxy compound, and (D) a reactive diluent are contained, and the (C) epoxy compound is It contains an epoxy compound having a tetraphenyl structure and three epoxy groups in the molecule and a (C-2) crystalline epoxy compound, and the (D) reactive diluent is (D-1) caprolactone-modified (meth). ) A photosensitive resin composition containing an acrylate. [Selection diagram] None |
| priorityDate | 2020-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 182.