| abstract |
PROBLEM TO BE SOLVED: To provide a curable polymer compound which can be molded into a film, has high adhesiveness, and has a low dielectric constant and a low dielectric loss tangent. Equation (1) (R 1 represents H or a methyl group. M and n are independently 1 to 2,000), and have a number average molecular weight of 30,000 or more and a phenolic hydroxyl group equivalent of 1. 000 g / eq. That is all. [Selection diagram] None |