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publicationDate 2022-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2022029527-A
titleOfInvention Thermosetting resin compositions and semiconductor devices
abstract PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which gives a cured product in which a plating layer formed on the surface of the cured product does not peel off from the cured product and cracks do not occur in the cured product. A thermosetting resin composition comprising (A) a thermosetting resin, (B) a laser direct structuring additive, (C) an inorganic filler, and (D) a coupling agent. D) Coupling agents are triazine functional group type, isocyanate functional group type, isocyanuric acid functional group type, benzotriazole functional group type, acid anhydride functional group type, azasilacyclopentane functional group type, imidazole functional group type and non-coupling agent. A thermosetting agent containing one or more selected from the group consisting of a saturated group-containing silane coupling agent, and having a thermosetting property other than a mercaptosilane coupling agent, an aminosilane coupling agent and an epoxysilane coupling agent. Resin composition. [Selection diagram] None
priorityDate 2020-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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