http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022026480-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F41-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 |
| filingDate | 2020-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b44f81f46d7e011ee302af755a069564 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e786a12e11024968f49763297e30179 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd4ac9cd94787037b54b88d60acce248 |
| publicationDate | 2022-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022026480-A |
| titleOfInvention | Manufacturing method of substrate with conductive pattern, fired body and electronic parts |
| abstract | PROBLEM TO BE SOLVED: To provide a manufacturing method capable of manufacturing a substrate with a conductive pattern capable of forming a thick film pattern and obtaining an electronic component with a low resistance electrode. SOLUTION: A conductive pattern 1 is formed by applying, drying, exposing and developing a photosensitive conductive composition containing a conductive powder having a D50 of 1.0 to 5.0 μm in a particle size distribution on a substrate (A). And (B) the substrate with the conductive pattern 1 is photosensitive containing a conductive powder having a D50 of 1.0 to 5.0 μm in a particle size distribution, which may be the same as or different from the conductive composition. A method for manufacturing a substrate with a conductive pattern, which comprises a step of laminating a conductive pattern 2 on the conductive pattern 1 by applying, drying, exposing, and developing the conductive composition, wherein the step (B) is 1. By performing up to 4 times, the number of laminated conductive patterns is reduced to 2 or more and 5 or less, and the ratio of the thickness T and D50 of each of the laminated conductive patterns after drying is T / D50 = 2.0 to 5.0. A method for manufacturing a substrate with a conductive pattern. [Selection diagram] None |
| priorityDate | 2020-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.