http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022012256-A

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filingDate 2020-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66685876f4d645228daccd620e14e17e
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publicationDate 2022-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2022012256-A
titleOfInvention Wiring board manufacturing method
abstract PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board capable of stably forming a wiring layer having a desired shape by using a solid electrolyte membrane. First, a base material with a seed layer is prepared. The base material with a seed layer has a predetermined pattern of the insulating base material, the conductive base layer provided on the insulating base material, and the surface of the base layer according to the wiring pattern. Includes a conductive seed layer provided on the first region. Next, a solution containing at least one additive selected from the group consisting of a polymer, a brightener, and a leveler is applied to the substrate with a seed layer. Next, a solid electrolyte membrane containing a solution containing metal ions is placed between the seed layer and the anode, and the anode and the seed layer are subjected to pressure contact between the solid electrolyte membrane and the seed layer. A voltage is applied between them to form a metal layer on the surface of the seed layer. Then, the base layer is etched. [Selection diagram] Fig. 1
priorityDate 2020-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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