http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022012256-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dc45703f67bc72a6db582867886fd5d5 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00 |
filingDate | 2020-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66685876f4d645228daccd620e14e17e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2bae04121821b4e689f0be57136af904 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9821af50dbaf3e9fa5056223d2535873 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f691c5e28894b3b5ec8703269e485dfc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6383c244e90df2fc0c98c28685a02c2 |
publicationDate | 2022-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2022012256-A |
titleOfInvention | Wiring board manufacturing method |
abstract | PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board capable of stably forming a wiring layer having a desired shape by using a solid electrolyte membrane. First, a base material with a seed layer is prepared. The base material with a seed layer has a predetermined pattern of the insulating base material, the conductive base layer provided on the insulating base material, and the surface of the base layer according to the wiring pattern. Includes a conductive seed layer provided on the first region. Next, a solution containing at least one additive selected from the group consisting of a polymer, a brightener, and a leveler is applied to the substrate with a seed layer. Next, a solid electrolyte membrane containing a solution containing metal ions is placed between the seed layer and the anode, and the anode and the seed layer are subjected to pressure contact between the solid electrolyte membrane and the seed layer. A voltage is applied between them to form a metal layer on the surface of the seed layer. Then, the base layer is etched. [Selection diagram] Fig. 1 |
priorityDate | 2020-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.