http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022007782-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73e224665ceb7b15f8e66dfd0ee245c6 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-51 |
| filingDate | 2020-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be3da4be5f443fbb1b471e1fe41862d9 |
| publicationDate | 2022-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2022007782-A |
| titleOfInvention | Thermosetting resin composition for encapsulation, encapsulant for semiconductor, semiconductor device and manufacturing method thereof |
| abstract | PROBLEM TO BE SOLVED: To form a sealing material for sealing a gap between a semiconductor element and a substrate in a semiconductor device, have a low viscosity, have excellent gap penetration, and hardly cause unfilling of the sealing material. A thermosetting resin composition for encapsulation is provided. A thermosetting resin composition for encapsulation contains a thermosetting resin (A), an inorganic filler (B) and a dispersant (C). The dispersant (C) contains a salt of at least one of an acidic phosphoric acid chain ester and an acidic phosphorous acid chain ester and a polyamine. [Selection diagram] Fig. 1 |
| priorityDate | 2020-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 118.