http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022006741-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4e58a7247d4c843be828cff866761ddd |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30 |
filingDate | 2020-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ebaac11711ee1ea2f99ed9c94e168ed http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2a84ff38dfeb95bbf115fd52ed57cee http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_acf56b7de26071a4eed35c9079437e9a |
publicationDate | 2022-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2022006741-A |
titleOfInvention | Nickel colloid catalyst solution for electroless nickel or nickel alloy plating and electroless nickel or nickel alloy plating method |
abstract | PROBLEM TO BE SOLVED: To effectively improve the stability of a nickel catalyst solution over time, and to obtain a uniform and even nickel (or nickel alloy) film by electroless plating a non-conductive substrate to which a catalyst is applied. SOLUTION: A non-conductive substrate is immersed in a liquid containing a surfactant to perform a preliminary adsorption promotion treatment, and (A) a soluble copper salt, (B) a reducing agent, and (C) an oxycarboxylic acid or a poly. A nickel colloid catalyst solution for electroless nickel plating containing a predetermined colloidal stabilizer such as carboxylic acids and a predetermined synthetic water-soluble polymer such as (D) polyethyleneimines and polyvinylpyrrolidones is used to catalyze the non-conductive substrate. After applying, electroless nickel plating is performed. Since the components (C) to (D) are used in combination, the stability of the catalyst solution over time is effectively improved compared to the single use of the component (C), and the nickel (or nickel) is uniform and even by electroless plating. An alloy) film is obtained. [Selection diagram] None |
priorityDate | 2020-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 200.