http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021507952-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-133305
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filingDate 2019-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2021507952-A
titleOfInvention Polyimide precursor solution and polyimide film using it
abstract In the present invention, the polyimide precursor solution is produced by reacting tetracarboxylic acid dianhydride with diamine at a mol ratio of 1: 0.93 to 1: 0.99, and has a number average molecular weight of 38,000 g / mol. A polyimide film containing the above-mentioned polyimide precursor and having high heat resistance can be produced, and the polyimide precursor with improved storage stability by quantifying the defoaming property of the solution and adjusting the content of bubbles. A body solution can be provided. In addition, the polyimide film produced thereby can suppress the formation of cracks in the inorganic film generated at the time of element formation by reducing the number of bubbles inside the film.
priorityDate 2018-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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