| abstract |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition having good adhesiveness and excellent heat resistance and electrical characteristics. SOLUTION: The epoxy-modified polyolefin (X) and a curing agent (Q) are contained, and the epoxy-modified polyolefin (X) contains a polyolefin (A) and an epoxy group-containing vinyl monomer (B) as constituent raw materials. The weight ratio of ethylene, which is a constituent monomer of polyolefin (A), to α-olefin having 3 to 8 carbon atoms [ethylene / α-olefin having 3 to 8 carbon atoms] is 2/98 to 50/50. , A thermosetting resin composition (Z) in which the epoxy-modified polyolefin (X) satisfies all of the following requirements (1) to (3). [Selection diagram] None |