http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021181559-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_154f5a8a983d88f296117dcc92946ab4 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-221 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2463-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2433-00 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-068 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-686 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2021-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9041da1f4044c7898a20dc7f4ef8922 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c0c882fcd22925a2eed65947b06b7f0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dfcd3eb630dcc43969ea46e0569c8f4b |
| publicationDate | 2021-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2021181559-A |
| titleOfInvention | An epoxy resin composition for a semiconductor device encapsulating film, a film for encapsulating a semiconductor element, and a semiconductor device sealed using the same. |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition for a semiconductor element encapsulating film capable of shielding neutrons, a film for encapsulating a semiconductor element, and a semiconductor device sealed using the same. Liquid epoxy resins; hardeners; binder resins; and oxides, nitrides, carbides, and hydroxides containing at least one element selected from the group consisting of gadolinium, boron, samarium, cadmium, and europium. An epoxy resin composition for a semiconductor element encapsulating film containing at least one selected from the group consisting of substances; the content of the binder resin is the total amount of the epoxy resin composition for the semiconductor element encapsulating film. Oxides, nitrides, carbides, and hydroxides that are 2 to 10% by mass based on mass and contain at least one element selected from the group consisting of gadolinium, boron, samarium, cadmium, and europium. The content of at least one selected from the group consisting of the above is 50% by mass or more based on the total mass of the epoxy resin composition for a semiconductor element encapsulating film, which is an epoxy resin composition for a semiconductor element encapsulating film. .. [Selection diagram] None |
| priorityDate | 2020-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 124.