| abstract |
PROBLEM TO BE SOLVED: To provide a solder paste and a flux in which solder is wetted and spread by intentionally spreading the solder paste over the entire land because it is easily heated and dripping even when the solder paste is printed smaller than the area of the land. A cleaning flux contains a rosin-based resin, a solvent, a thixo agent, and an activator, contains a hydrohalide, a halogenated aliphatic compound, and an imidazole compound as the activator, and a halogen of the flux. Of the patterns shown in FIG. 6 in which the content is 9000 ppm or more and 50,000 ppm or less and the JISZ3284-3 “Dripping test during heating” method established in 2014, all the printed fluxes are after heating at 90 ° C./3 min. The minimum distance that does not become one is 1.2 mm or more. [Selection diagram] None |