http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021152159-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
filingDate | 2021-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abc465ef57424437c79480d594e976cd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec29d1290730128218e28ef649571896 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50b0dad22acb5b4f946ae89c8ba6ef11 |
publicationDate | 2021-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2021152159-A |
titleOfInvention | Epoxy resin-containing varnish, epoxy resin composition-containing varnish, prepreg, resin sheet, printed wiring board, semiconductor device |
abstract | PROBLEM TO BE SOLVED: To produce an epoxy resin-containing varnish which can be handled in the form of a varnish having high stability in a solvent, an epoxy resin composition varnish using the varnish, a prepreg impregnated into equipment, or a resin sheet, and the like. Provided is a laminated plate having high heat resistance and high dielectric properties. An epoxy resin-containing varnish composed of an epoxy resin represented by the general formula (1) and an organic solvent. (Ratio of (a) and (b); (a) / (b) = 1 to 3. G is a glycidyl group. N is 0 to 5.) [Selection diagram] None |
priorityDate | 2018-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 95.