| abstract |
PROBLEM TO BE SOLVED: To provide a heat conductive resin composition capable of lowering the melt viscosity of a resin without lowering the amount of a heat conductive filler added. SOLUTION: It contains 30 to 60% by mass of at least one thermoplastic resin selected from the following group (A), 35 to 65% by mass of a thermally conductive filler, and 1 to 20% by mass of an aromatic polyester resin having liquid liquidity. A thermally conductive resin composition characterized by (A) Polyphenylene sulfide resin, polyaryl ether resin, polyaryl ether ketone resin, melt-processable fluororesin [Selection drawing] None |