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filingDate 2020-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d031f99746bc0726204a4b39ef5938e
publicationDate 2021-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2021132055-A
titleOfInvention Flexible substrate after etching
abstract PROBLEM TO BE SOLVED: To reduce transmission loss in high frequency wireless communication by making a predetermined value of surface roughness on a side surface of wiring after etching under predetermined conditions without strict control of etching conditions. The rear flexible substrate 10 is provided. A flexible substrate 10 after etching includes a base film 11, a base metal layer 12 directly superimposed on the base film 11, and a copper conductor layer 20 directly superimposed on the base metal layer 12. The surface roughness Rz on the side surface of the wiring after etching the substrate 10a with an etching solution having a predetermined concentration for a time corresponding to the total thickness of the copper conductor layer 20 and the base metal layer 12 is 1. It is 0 μm or less. With this configuration, since the surface roughness of the peripheral surface of the wiring is reduced, it is possible to provide the etched flexible substrate 10 with reduced transmission loss for high-frequency wireless communication. [Selection diagram] Fig. 1
priorityDate 2020-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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