http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021130737-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2020-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa3f74590e6ec111a8fcdbf61bfe679c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1de19c748bf6e27a8fb54b723609496e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e70e6e5d504685779565faf37e184cd |
| publicationDate | 2021-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2021130737-A |
| titleOfInvention | Encapsulating resin composition and electronic device |
| abstract | PROBLEM TO BE SOLVED: To reduce dielectric loss tangent of a cured product of a sealing resin composition. A sealing resin composition of the present invention contains an epoxy resin, a curing agent, an inorganic filler, and a coloring agent, and satisfies the following conditions. Conditions: The dielectric loss tangent at 5 GHz and 23 ° C. of the cured product cured at 175 ° C. for 2 minutes using the sealing resin composition is less than 0.008. [Selection diagram] Fig. 1 |
| priorityDate | 2020-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 143.