| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_505cac1493bf25d67a2d3bbac830f671 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F2027-2809
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02J50-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F41-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F41-042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F38-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F27-2871
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F27-2804
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02J50-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-246
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02J50-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F41-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02J50-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F5-003 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H02J50-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F38-14 |
| filingDate |
2021-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7937fc3fd3b970b0b54a10fdcd0965b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30ea9dc1f29831ba9de74851c4ea1fbe |
| publicationDate |
2021-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2021129108-A |
| titleOfInvention |
Plated copper conductor structures for wireless charging systems and their manufacture |
| abstract |
PROBLEM TO BE SOLVED: To provide a plated copper conductor structure for a wireless charging system and manufacture thereof. A conductive structure is formed by first printing a precursor seed layer of a conductive ink and then electroplating a highly conductive metal such as Cu or Ag onto the precursor to form a base material (soft or hard). Either) is manufactured on. The plated layer has a conductivity close to that of bulk metal. To improve plating uniformity, an electroless metal interposition layer can be deposited on the precursor prior to electroplating. The structure can be used for applications such as coils used in wireless power transfer systems. [Selection diagram] Fig. 1 |
| priorityDate |
2020-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |