| abstract |
PROBLEM TO BE SOLVED: To obtain a cured product having low dielectric properties, high heat resistance, excellent desmear property and capable of suppressing surface tackiness (adhesiveness), and can be applied to a laminated wiring board. To provide a resin composition having moldability. Surface treatment with (A) polyphenylene ether compound, (B) maleimide compound, (C) curing agent, (D) phosphinic acid metal salt-based flame retardant, and (E) hydrophobic silane coupling agent. (F) Inorganic filler surface-treated with a hydrophilic silane coupling agent, and the (E) inorganic filler is the same as the (E) inorganic filler and the (F) inorganic filler. A resin composition contained in an amount of 20 to 80% by mass based on the total amount. [Selection diagram] Fig. 1 |