| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate |
2021-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7cc1048f6c2ad9ec0be2ecca9d3c885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4308752e855a46f4a236d7230610c13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3e3a0dda8e3be8b2558829dda2bc0e7 |
| publicationDate |
2021-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2021120462-A |
| titleOfInvention |
Thermosetting resin compositions, resin-sealed substrates, and electronic devices |
| abstract |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition capable of suppressing mold sticking at the time of mold molding. A thermosetting resin composition used for forming a resin-sealed substrate, wherein the surface energy of a cured plate obtained by curing the thermosetting resin composition at 175 ° C. is 30 mN / m or less. Depends on the curable resin composition. [Selection diagram] Fig. 1 |
| priorityDate |
2016-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |