http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021096316-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c067d1bbfe85ac23d961d454a35d0e |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
filingDate | 2019-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_175a83b687441149c7d9c10fad756d9f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30f7ca19ee297bba72ba9a4680d0e3ab |
publicationDate | 2021-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2021096316-A |
titleOfInvention | Photosensitive resin composition |
abstract | PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of obtaining a photocurable product having a matte appearance and excellent resolution while having solder heat resistance and insulation reliability. SOLUTION: (A) a carboxyl group-containing photosensitive resin, (B) an epoxy compound, (C) an aliphatic urea compound, (D) a reactive diluent, (E) a photopolymerization initiator, and the like. The (B) epoxy compound contains (B1) a crystalline epoxy compound having a melting point of 130 ° C. or higher, and the (B1) melting point is relative to 100 parts by mass of the (A) carboxyl group-containing photosensitive resin. Contains 9.0 parts by mass or more of the crystalline epoxy compound at 130 ° C. or higher, and 9.0 parts by mass or more of the (C) aliphatic urea compound with respect to 100 parts by mass of the (A) carboxyl group-containing photosensitive resin. Epoxy resin composition. [Selection diagram] None |
priorityDate | 2019-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 198.