http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021091805-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d5d04736b0b882a4f5a1e0e0e4cd8cbb |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F4-40 |
| filingDate | 2019-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb3ba738def985796bc1dd77ecb3b3be |
| publicationDate | 2021-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2021091805-A |
| titleOfInvention | Thermosetting resin composition |
| abstract | PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which can be cured even in a normal temperature environment (40 ° C. or lower) and gives a cured product having excellent adhesiveness to a metal substrate. SOLUTION: Vinyl ester resin (A), phosphoric acid group-containing unsaturated monomer (B), ethylenically unsaturated monomer (C) other than (B), metal soap (D), and thermal radical initiation. The phosphoric acid group-containing unsaturated monomer (B) containing the agent (E) is the vinyl ester resin (A), the phosphoric acid group-containing unsaturated monomer (B), and the ethylenically unsaturated monomer (B). A thermocurable resin composition contained in an amount of 0.01 to 0.2% by mass based on the total amount of the monomers (C). [Selection diagram] None |
| priorityDate | 2019-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 114.