| abstract |
PROBLEM TO BE SOLVED: To provide an organic film material having excellent film forming property, high etching resistance, excellent twist resistance and embedding characteristics, a pattern forming method using the organic film material, and a polymer suitable for such an organic film material. .. SOLUTION: The material for forming an organic film, which contains a polymer having a repeating unit represented by the following general formula (1) and an organic solvent. [Chemical 1] (In the above general formula (1), AR1 and AR2 are benzene rings or naphthalene rings which may have a substituent. W 1 is a divalent organic group having 2 to 20 carbon atoms which does not have an aromatic ring. Yes, the methylene group constituting the organic group may be substituted with an oxygen atom or a carbonyl group. W 2 is a divalent organic group having at least one aromatic ring and having 6 to 80 carbon atoms.) [Selection diagram] None |