http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021073097-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 |
| filingDate | 2021-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f3aecdc035523c85d0e320fda9dcc34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a1d045d9909ca95b38ef30b42a9b1ba |
| publicationDate | 2021-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2021073097-A |
| titleOfInvention | Solder alloy and solder powder |
| abstract | PROBLEM TO BE SOLVED: To provide a solder paste capable of suppressing an increase in viscosity. SOLUTION: A solder made of a solder alloy containing 90.0 to 99.8 wt% of Sn, 0.1 to 6 wt% of Ag, a mass ratio of 30 ppm to 100 ppm of As, and Cu as a balance. A solder paste containing powder and a rosin-based flux. The solder alloy contains 0.06 to 0.3 parts by mass with respect to 100 parts by mass of Ag and 0.3 to 1.8 parts by mass with respect to 100 parts by mass of Cu. [Selection diagram] None |
| priorityDate | 2013-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.