| abstract |
PROBLEM TO BE SOLVED: To provide an active ester compound having excellent dielectric properties and copper foil adhesion in a cured product, a curable composition containing the active ester compound and the cured product thereof, a semiconductor encapsulating material using the curable composition, a printed wiring board and the like. Provide build-up film. Specifically, the molecular structure has a fluorinated hydrocarbon structure site (F) and a plurality of aromatic ester structure sites (E), and an aryloxycarbonyl structure (P) is provided at the molecular end. Alternatively, an active ester compound having an arylcarbonyloxy structure (A), a curable composition containing the active ester compound and a cured product thereof, a semiconductor encapsulating material using the curable composition, a printed wiring substrate, and a build-up film. .. [Selection diagram] None |