http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021054922-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2019-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69c84fa7cfdcdc7e226cf81866404aaa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_befc99a4f68f5dcb149b801899ea4db9 |
| publicationDate | 2021-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2021054922-A |
| titleOfInvention | Composition for forming heat conductive material, heat conductive material, heat conductive sheet, device with heat conductive layer |
| abstract | PROBLEM TO BE SOLVED: To provide a composition for forming a heat conductive material which is excellent in heat conductivity and can provide a heat conductive material having a high dielectric breakdown voltage. Further, the present invention provides a heat conductive material, a heat conductive sheet, and a device with a heat conductive layer relating to the composition for forming the heat conductive material. SOLUTION: An epoxy compound, a phenol compound, boron nitride particles A which are aggregated and have an average particle size of 25.0 to 60.0 μm, and an average particle size of 1.0 to 5.0 μm. A composition for forming a heat conductive material containing boron nitride particles B, wherein the total content of the boron nitride particles A and the boron nitride particles B exceeds 70.0% by mass with respect to the total solid content. A composition for forming a heat conductive material, wherein the composition T in which the epoxy compound and the phenol compound are blended so as to have an equivalent ratio of 1 has a viscosity of 10 Pa · s or less at 120 ° C. [Selection diagram] None |
| priorityDate | 2019-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 97.