http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020527855-A
Outgoing Links
Predicate | Object |
---|---|
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32477 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4404 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32495 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-0227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32133 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30604 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-455 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31 |
filingDate | 2018-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2020-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2020527855-A |
titleOfInvention | A method for controllingly removing a protective layer from the surface of a component |
abstract | A method 14 for controlling the protective layer 3 from the surface of the component 10, wherein the component is: Base 1 and An intermediate layer 2 that at least partially covers the substrate, The method comprises the protective layer 3 comprising an amorphous material, particularly an amorphous non-metal, particularly an amorphous ceramic, at least partially covering the intermediate layer. In step 11 of bringing the protective layer 3 into contact with the etching medium or the solvent 4, Including step 12 of removing the protective layer 3 under the action of an etching medium or solvent 4 until the intermediate layer 2 is exposed. The etching medium or solvent causes a first etching or dissolution rate of the protective layer and a second etching or dissolution rate of the intermediate layer, the first etching or dissolution rate being greater than the second etching or dissolution rate, the method. 14. The present invention further relates to a method of replacing an old protective layer on a component, a method of operating a thin film process facility, a component for use in a thin film process facility, and a method of manufacturing the component. |
priorityDate | 2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.