http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020527855-A

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32477
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4404
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-0227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32133
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30604
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-455
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31
filingDate 2018-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2020-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2020527855-A
titleOfInvention A method for controllingly removing a protective layer from the surface of a component
abstract A method 14 for controlling the protective layer 3 from the surface of the component 10, wherein the component is: Base 1 and An intermediate layer 2 that at least partially covers the substrate, The method comprises the protective layer 3 comprising an amorphous material, particularly an amorphous non-metal, particularly an amorphous ceramic, at least partially covering the intermediate layer. In step 11 of bringing the protective layer 3 into contact with the etching medium or the solvent 4, Including step 12 of removing the protective layer 3 under the action of an etching medium or solvent 4 until the intermediate layer 2 is exposed. The etching medium or solvent causes a first etching or dissolution rate of the protective layer and a second etching or dissolution rate of the intermediate layer, the first etching or dissolution rate being greater than the second etching or dissolution rate, the method. 14. The present invention further relates to a method of replacing an old protective layer on a component, a method of operating a thin film process facility, a component for use in a thin film process facility, and a method of manufacturing the component.
priorityDate 2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0995772-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016208034-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016042496-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004134690-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453615033
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID123105
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID60966
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID28123
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426285897
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14798
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID518712
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419593443
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559577
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID409060395
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14923
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453327643
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419579069
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419530175

Total number of triples: 35.