http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020501359-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32477 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3171 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32715 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate | 2017-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020501359-A |
| titleOfInvention | Method and apparatus for plasma dicing a semiconductor wafer |
| abstract | The present invention provides a method for plasma dicing a substrate. A substrate is provided with a top surface and a bottom surface, the top surface of the substrate having a plurality of street areas and at least one device structure. A substrate is placed on the support film on the frame to form a work piece. A process chamber having a plasma source is provided. A work piece support is provided in the plasma processing chamber. The work piece is placed on a work piece support. A plasma is generated from a plasma source in a plasma process chamber. The work piece is processed using the generated plasma and by-products generated from the support film while the support film is exposed to the generated plasma. |
| priorityDate | 2016-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.