| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0749dd1196065a3202ccc2fbf41894cd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-95
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0066 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0093
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-156
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0753
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-167
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G09F9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G09F9-33 |
| filingDate |
2020-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abd7ef2b91d4a091b449507eb454d9d8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5f6a367ac1e2f273a29ceca14629da3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_468c7ebc88251f48e835ad42082beb01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1405b73d36a7b18d7ab8cf1a26403209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1002bfc94855e397a629b4c9f9d5cd6e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0252cb6cae85b1c2bd1192aa4850592 |
| publicationDate |
2020-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2020198437-A |
| titleOfInvention |
How to generate a light emitting diode array on the backplane |
| abstract |
A backplane 401 is provided that optionally has a stepped horizontal surface and optionally has a metal interconnect structure embedded therein. The first conductive adhesive structure 431 is formed on the first stepped horizontal plane. The first light emitting device 10B on the first transfer substrate is placed on the first conductive adhesive structure, and the first subset of the first light emitting device is adhered to the first conductive adhesive structure. Using a laser emission 477 to selectively disconnect the first subset of the first light emitting device from the first transfer board while the second subset of the first light emitting device remains attached to the first transfer board. Can be done. [Effect] Unless the additional device is located in a position overlapping the existing first light emitting device or the device in the adhesive position on the backplane, the additional device on each additional transfer board is additionally conductive on the backplane. It can be bonded to the bonded structure using the same method. [Selection diagram] FIG. 32M |
| priorityDate |
2014-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |